Direct copper bonding (DCB) substrates are often used due to their good thermal conductivity in high-performance modules. They consist of a ceramic substrate board, usually alumina or aluminum nitride and usually applied with a copper foil on one or both sides in a high temperature oxidation process. Precisely because of the high power requirements (DCB substrates carry currents up to several thousand volts at temperatures up to 200° C), these components must be absolutely free of production residues for further working processes such as wire bonding, coating or varnishing.
Thorough removal of flux, rosin, resin, Cu oxide and soldering support substances are the main tasks in the cleaning of DCBs, hybrids, assemblies / assembled printed circuit boards, in order to be able to offer correspondingly process-safe assemblies for the above mentioned subsequent processes.
kolb provides for the cleaning of DCB substrates the complete cleaning process as a manufacturer from a single source: including machinery, accessories, cleaners and specially applied electronic process control.
Vertical fourfold spray rotors, CWA® supercharger compression drying
Process chamber dimensions: W 700 • H 710 • D 720 mm (W 27.55" • D 28.34" • H 27.95")
more about AQUBE® XV7
Vertical eightfold spray rotors, CWA® supercharger compression drying
Process chamber / 4slots: W 77 - 110 • D 900 • H 800 mm (W 3.03 - 4.33" • D 35.43" • H 38.5")
more about AQUBE® XV9
Most suitable for: assembled PCBs, DCBs, ceramic substrates, also screens, stencils, PumpPrints and misprints.
more about MultiEx® 3D series