AQUBE® MV9 QUAD
Cleans screens, stencils and PumpPrints from SMD paste, SMD adhesive, soldering support substances, oil & dust
The AQUBE® MV9 QUAD is a fully automatic large-scale system for the reliable fine cleaning of four screens, stencils or PumpPrints in one wash cycle. Ideal for large-scale production facilities with several stencil printers.
It removes contaminants such as SMD paste, SMD adhesive, conductive materials, flux, oil, grease or dust quickly and thoroughly.
This system can supply up to four printers with freshly cleaned and dry stencils or screens every quarter of an hour. The configuration with two tanks and two independent circuits as well as ClosedLoop water treatment as a standard ensures short throughput times and makes this machine the perfect economic choice for thorough volume cleaning of stencils and screens.
The compact, easy-to-operate and easy-to-maintain system is Smart-Factory-ready.
Highlights
- Two-tank system with two separate circuits
- Average process time: 28 min/cycle = approx. 7 min per stencil
- Intelligent network connectivity for implementation in industry 4.0 smart factories
- Fully automatic 4-step process: cleaning, MediumWipe®, rinsing, CWA® supercharger compression drying
- Vertical PTFE-mounted rotor system with eight ASYNCHRON® spray rotors for thorough wetting (no blind spots)
- Water free operation possible with a suitable cleaning/rinsing detergent
- ClosedLoop reprocessing of cleaning and rinsing fluids as standard feature
- Processes and service intervals PLC controlled with event issuing and software control via touch screen
- Safe installation close to the production line/screen printer possible; no special protection required
- Maximum performance on a comparably small footprint, large access points for quick and easy maintenance
Technical data | |
|---|---|
| Technology base | kolb PowerSpray® |
| Control system (Display size) | PLC - Eaton (10“) |
| Standard capacity (per process cycle) | 4 screens/stencils/carriers up to 800 x 940 (31.5“ x 37") |
| Process chamber dimensions | W 970 mm • D 955 mm • H 900 mm |
| Clamping space for PCBA, Misprints etc. | H 730 mm x W 525 mm |
| Max. stencil, carrier, washing frame size | H 800 mm x W 940 mm |
| Circuits | 2: Cleaning, Rinsing |
| Volume Tank A | 125 l • Cleaning |
| Volume Tank B | 125 l • Rinsing tap water |
| Max. cleaning temperature | 50 °C (122 °F) |
| Filtration | 1. Full flow coarse filter < 2mm (0.08"), 2. 20“ fine filter (1 - 100µm - process dependent) |
| Drying System | CWA® supercharger |
| Drying temperature range | Compressed warm air |
| Power supply | 400 V AC, 32 A, CEE plug / 3 Ph / 50 or 60 Hz |
| Power consumption | 8 kW |
| Supply connection 1 (tap water) | 1“ |
| Supply connection 2 (DI water) | 1“ |
| Supply connection 3 (Compressed Air) | 8 mm (87 - 116 psi - 100 l / min) |
| Empty Weight | 950 kg (2,095 lbs) |
| Footprint | 1700 mm x 1850 mm (66.93″ x 72.83″) |
Certifications
Downloads
back











