The cleaning tasks in the electronics producing industry can be differentiated into two segments: Product Cleaning and Tools Cleaning. Product Cleaning is described as the cleaning of highly sensible components and is an integrated part of the value-added chain. This includes among other the demanding cleaning of assembled PCBs, Hybrids and DCBs and misprints of single side mounted PCBs.
Tools Cleaning covers all other cleaning processes that immediately affect the value-added chain. It includes fine cleaning misprints (bare boards) as well as stencils, screens and PumpPrints, but also the maintenance cleaning of carriers, solder frames, filters, tubes, soldering ovens etc.
The kolb Application-Indicator indicates the suitability of the respective machines for the different cleaning applications, which makes it easy to determine qualified systems for you individual requirements.
New Generation cleaning systems, smart factory ready (SFr), for efficient and reliable volume cleaning of screens, stencils, PumpPrints or carriers, magazines, machinery parts from contaminations such as SMD adhesives, solder paste, flux, oil or dust.
Capacity per cleaning cycle:
Up to 4 stencils, carriers, masks, up to a size of 800 x 940 mm (31,5 "x 37")
or up to 28 carriers up to a size of 750 x 950 mm (29.5" x 37.5")
more about AQUBE M series
Allround systems for all aspects of maintenance cleaning with PowerSpray® technology. Removing flux, oil, dust and grease from carriers / frames, ESD boxes, PCB storage racks, pallets, machine parts and other small parts (such as turning and milling parts) from production.
Process chamber dimensions: up to L 970 • W 955 • H 900 mm
more about PSE M series
Extremely compact PowerSpray® systems, specifically for the cleaning of screens, stencils and misprints from SMD paste, SMD adhesives, flux, oil, dust, grease.
Capacity: cleaning goods / stencils, screens etc. up to 780 x 950 mm (31 "x 37.5") or two stencils in one cleaning cycle up two 900 x 800 mm (35 "x 32")
more about PSE 300 series
Rugged state of the art systems for maintenance cleaning with easy to handle air-in-immersion AirFlow® technology. For the cleaning of condensation traps, solder-frames, carriers, boxes, magazines and machine parts.
Process chamber dimensions up to W 1.300 • D 450 • H 600 mm resp. W 1.030 • D 770 • H 600 mm
more about AF series