陶瓷基质与混合板清洗

The trend towards miniaturization while increasing the reliability and operation of electronics in high temperature environments has driven the development of ceramic substrates. Ceramic substrates are mainly used for high performance electronic ceramic circuit boardswithe High Temperature Co-Fired Ceramics (HTCC) technology (usually made of aluminum oxide) and / or with Low Temperature Co-Fired Ceramics (LTCC) technology (usually made of glass ceramics). Ceramics as materials are intended to make the electronics thermally stable.

High temperature applications in the automotive industry, particularly reliable medical applications and high-frequency modules for wireless communication needs are just a few areas of application of this often multi-layered laminated components. Precisely because of their complexity, their value and sensitive areas of application, they must be absolutely free of production residues for further work processes such as wire bonding, coating or varnishing.

The thorough removal of flux residues, colophony, resin, oxides and soldering materials are the main tasks when cleaning ceramic substrates, PCB assemblies, DCBs and hybrids so that for any following production step process-safe products can be provided.