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ServiceCase SC600
专用于迅速检查助焊剂残留成分

如果助焊剂残留成分在PCB集成电路板的生产中是被严格要求彻底清除的,那么保证清洗的品质就必须做常规检查,生产失败率最小化。

kolb FluxControl测验组合,用于PCBS,与其各自重要焊点的助焊残留成分可以进行快速且简单地检查。助焊活性剂可以被简单地隐藏于与kolb FluxControl反应中。

本应用非常简单:

从FluxControl的瓶中取 50ml 的溶液,滴1-2滴溶液于集成电路板的焊点上,然后等待1-2分钟后用DI水冲洗,这时,观察结果,如果冲洗无痕,证明已洗干净,如果有蓝色的痕迹,证明清洗不充分。

在操作以前,请阅读技术文档(与工具箱一起快递的)和安全数据表(可以从本页面中下载)

 



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