Best possible cleaning today is the prerequisite for a reproducible quality in production as well as the reduction of expensive production stands-stills. The trend is the installation of highly automated, quickand cost-saving yet efficient and reliable processes that ensure high customer satisfaction.
The cleaning tasks in the electronics producing industry can be differentiated into three segments: Ultrafine Cleaning, Fine Cleaning and Maintenance Cleaning.
The Ultrafine Cleaning describes the cleaning of highly sensible components and is an intregrated part of the value-added chain.
This includes among other the demanding cleaning of assembled PCBs, Hybrids and DCB’s.
The Fine Cleaning covers all other cleaning processes that immediately affect the value-added chain.
Basic Fine Cleaning includes misprints as well as stencils in metal and PumpPrint-stencils.
The differentiation to Maintenance Cleanign starts with the cleaning of carriers and solder frames.
The kolb Application-Indicator shows this differentiation and it indicates the suitability of the respective machines for the different cleaning applications.
Complete Overview: Application-Indicator
PSB600 series
DCB cleaning systems for highest demands that is process safe ultra fine cleaning of SiP, HDI boards, DCB, hybrids and misprints from fluxes, rosin, resin, copper, Cu oxide and aggressive solder-support substances. Up to 540 (8,6 qm) eurocards in one cycle (relative cleaning period per board: approx. 10 seconds).
PSB500 series
Standard cleaning systems for the process safe ultra fine cleaning of PCB, hybrids and misprints from fluxes, rosin, resin, Cu oxide and aggressive solder-support substances. Up to 540 (8,6 qm) eurocards in one cycle (relative cleaning period per board: approx. 10 seconds).