In electronic manufacturing clean production tools are the basic requirement for high quality production standards. Solder frames and carriers from selective soldering machines have to be cleaned on a regular basis, to ensure functionality with the necessary qualitiy. Up-to-date reflow-soldering systems very often have flux management systems (cooling unit, filters, heat exchanges, containers / plates) which during operation will be subject to contamination (flux / colofonium). Thorough cleaning helps to regain proper functioning.

kolb AF15

The advantages of AF15:

• Customized solder-frame and carrier fixture available on demand.
• Loading and unloading in an empty process chamber.
• High clean efficiency.
• Short cycle times.
• Fully automatic process: cleaning - rinsing - drying.
• Cleaning circulation with separate fine filtering (standard).
• Rinsing circulation with separate fine filtering (standard).
• Maintenance and operation events PLC controlled and displayed.
• Rugged casing made of stainless steel.
• Process relevant sections are made of electrolysis resistant elements.
• Simple and quick maintenance.
• Plug & Work system (connect, fill, start).

 

Operation conditions:

• Power supply / power consumption 400 V AC, 16 A CEE, 50 / 60 Hz ca. 3 kW.
• Minimum ambient temperature app. 20°C.
• Noise emission < 59 dB (A).
• Compressed air connection ca. 6-10 bar, 110 l/min.
• Weight app. 460 kg (empty), 910 kg (filled)
• Contents TA-cleaning app. 225 l, TB-rinsing app. 225 l.
• Usable chamber dimensions 1.000 mms x 450 mms x 450 mms (L x W x H).
• Maximum space required app. L: 1.820 mms, W: 1.115 mms, H: 1.100 - 1.300 mms
• Exhaust connection (prov. by customer) 160 mms average, 200 / 300 ccm per hour.