Powerful technology, modest investment cost, environmentally friendly process: Up to now, all these requirements could not be fulfilled simultaneously when cleaning solder-frames, carriers and condensation traps. kolb has developed a technology, that fulfils all these requirements: efficient cleaning systems, environmentally sound cleaning fluids, surprisingly low investment and running costs.

kolb AF04

• AirFlow^®-system for solder frames, carriers, condensation traps and many more with cleaning-, rinsing- and drying chamber.
• Capacity: 6-9 solder frames (up to 610x380 mm).
• Ready for operation (plug & work), incl. cleaning fluid for the first filling.
• Viable price compared to the investment cost of a solder machine.
• Low running cost for the cleaning system.
• PLC maintenance control.
• High economic efficiency.
• Solder-frame and carrier fixture customized free of charge.
• Special system sizes on demand.
  
  

The AirFlow^® (AF^®)-cleaning principle:

• Air supported circulation (AF)-principle where the contaminated parts are constantly submerged in cleaning fluid.
• Water based cleaning fluids with high efficiency.
• Short cleaning cycles.
• Low maintenance.
• Low operating expenses: water and compressed air.
  
  

Operating conditions:

• Approx. +20°C ambient temperature
• Air pressure supply app. 6 bar, 100l/min
• Mains power supply: 230 V AC / 2kw / 16 A
• Mains water connection
• Drainage connection