Powerful technology, modest investment cost, environmentally friendly process: Up to now, all these requirements could not be fulfilled simultaneously when cleaning solder-frames, carriers and condensation traps. kolb has developed a technology, that fulfils all these requirements: efficient cleaning systems, environmentally sound cleaning fluids, surprisingly low investment and running costs.
kolb AF04
- AirFlow®-system for solder frames, carriers, condensation traps and many more with cleaning-, rinsing- and drying chamber.
- Capacity: 6-9 solder frames (up to 610x380 mm).
- Ready for operation (plug & work), incl. cleaning fluid for the first filling.
- Viable price compared to the investment cost of a solder machine.
- Low running cost for the cleaning system.
- PLC maintenance control.
- High economic efficiency.
- Solder-frame and carrier fixture customized free of charge.
- Special system sizes on demand.
The AirFlow® (AF®)-cleaning principle:
- Air supported circulation (AF)-principle where the contaminated parts are constantly submerged in cleaning fluid.
- Water based cleaning fluids with high efficiency.
- Short cleaning cycles.
- Low maintenance.
- Low operating expenses: water and compressed air.
Operating conditions:
- Approx. +20°C ambient temperature
- Air pressure supply app. 6 bar, 100l/min
- Mains power supply: 230 V AC / 2kw / 16 A
- Mains water connection
- Drainage connection



