Cost intensive cleaning systems are economically not acceptable for many companies. kolb has created a cost/value ratio that can be called a "clean" alternative in every sense:

 

kolb AF03

• Small AirFlow^®-system for condensation traps, solder frames, carriers and many more with cleaning chamber, rinsing chamber, drip tray and storage cabinet.
• Capacity: 4-6 Solder frames (up to 460x385 mms).
• Ready for operation (plug & work), incl. cleaning fluid for the first filling.
• Viable price compared to the investment cost of a solder machine.
• Low running cost for the cleaning system.
• High economic efficiency.
• Solder-frame and carrier fixture customized free of charge.
• Special system sizes on demand.

 

The AirFlow^® (AF^®)-cleaning principle:

• Air supported circulation (AF)-principle where the contaminated parts are constantly submerged in cleaning fluid.
• Water based cleaning fluids with high efficiency.
• Short cleaning cycles.
• Low maintenance.
• Low operating expenses: water and compressed air.

        

Operating conditions:

• Approx. +20°C ambient temperature
• Air pressure supply app. 4 bar, 80-110l/min
• Drainage connection